Memory specialist Micron Technology announced that it has started sampling industry’s fastest 512 Mb Mobile DRAM component, that will power the upcoming notebook and ultra-mobile PC systems. Mobile
applications are increasingly growing and demand more and more resources from a version to another, and memory becomes a critical element for the system's overall performance.
Micron's Mobile DRAM meets the mobile users' computing needs by delivering maximum clock speeds of up to 200MHz and impressive data transfer rates of up to 400 Mb/s. The delivered bandwidth will be enough to allow the notebook to engage in memory-intensive applications such as high speed video, 3D rendering or hardcore computing.
"The trend of full-featured mobile products that offer more audio, video and computing functionality only continues to grow, creating an increased demand for memory products that can support these advanced capabilities," said Bill Lauer, senior director of marketing for Micron’s memory group. "With its industry-leading speed, small form factor and reduced power consumption, Micron’s 512 Mb Mobile DRAM is ideal for meeting the requirements of today’s handheld products."
The Micron memory modules are fully compliant to the JEDEC standard 1.8 volt input/output (I/O), but, at the same time, the memory chips allow for a 1.2 volt I/O option that enhances high-speed and high-bandwidth signaling. The memory modules can work in extremely harsh, industrial environments, with temperatures ranging from -40 degrees Celsius to +85 degrees Celsius.
Micron also plans to mix the 512 Mb Mobile DRAM with NAND flash and Managed NAND parts, in order to offer it in a multi-chip package or a package-on-package stack. Although the company is sampling the first units of Mobile RAM to its selected partners, OEM vendors and system builders, the modules will hit the market during the second quarter of the year. There is no word on pricing yet.
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